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FPC Board
Technical description: Layer: 2; Material: FR4;Board thickness: 0.1mm;Surface finish: OSP;Min through hole: 0.2mm(12mil);Min line width: 0.1mm(4mil); Min line space: 0.1mm(4mil) ;Special requ...

Rigid-Flex Borad
Technical description: Layer: 4; Material: FR4; Board thickness: 1.6mm; Surface finish: OSP; Min through hole: 0.2mm(12mil); Min line width: 0.1mm(4mil;) Min line space: 0.1mm(4mil); Special. requ...

Blind & buried hole board
Technical description: Layer: 8; Material: FR4; Board thickness: 1.6mm; Surface finish: Goldfinger; Min through hole: 0.2mm(12mil); Min line width: 0.1mm(4mil); Min line space: 0.1mm(4mil); Special requ:blind and buried hole.

HDI board
Technical description: Layer: 24; Material: FR4; Board thickness: 3.0mm; Product usage:borad for laptop; Min through hole: 0.2mm(12mil).

Immersion Gold board
Technical description: Layer: 8; Material: FR4; Board thickness: 2.0mm; Surface finish: immersion gold; Min through hole: 0.2mm(12mil); Min line width: 0.1mm(4mil); Min line space: 0.1mm(4mil); Special requ...

Difficulty Board
Technical description: Layer: 20; Material: FR4; Board thickness: 1.6mm; Surface finish: OSP; Min through hole: 0.2mm(12mil); Min line width: 0.1mm(4mil); Min line space: 0.1mm(4mil); Special requ...

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